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DIFF Subgroup
B23K 26/388

Trepanning, i.e. boring by moving the beam spot about an axis

Introduced: January 2014

Full Title

Full titles differ between systems:

IPC:

Working by laser beam, e.g. welding, cutting or boring > Removing material > by boring or cutting > by boring > Trepanning, i.e. boring by moving the beam spot about an axis

CPC:

Working by laser beam, e.g. welding, cutting or boring > Removing material (B23K26/55, B23K26/57 take precedence) > by boring or cutting > by boring > Trepanning, i.e. boring by moving the beam spot about an axis

No child classifications to compare. This is a leaf node in both IPC and CPC.

Top Applicants

Top Applicants (IPC)

Class B23,2013–2023, worldwide · Source: EPO PATSTAT

  1. ITW (ILLINOIS TOOL WORKS) US 3,407
  2. FANUC JP 3,120
  3. DISCO ABRASIVE SYSTEM 2,777
  4. HAN'S LASER TECHNOLOGY INDUSTRY GROUP COMPANY 2,629
  5. ROBERT BOSCH DE 2,468
  6. FANUC 2,273
  7. DISCO CORPORATION JP 2,267
  8. GE (GENERAL ELECTRIC COMPANY) US 1,611
  9. CHINESE ACADEMY OF SCIENCES 1,534
  10. ISCAR IL 1,499

Top Applicants (CPC)

Class B23,2013–2023, worldwide · Source: EPO PATSTAT

  1. ITW (ILLINOIS TOOL WORKS) US 3,642
  2. DISCO CORPORATION JP 3,316
  3. FANUC JP 3,111
  4. ROBERT BOSCH DE 2,711
  5. FANUC 2,163
  6. GE (GENERAL ELECTRIC COMPANY) US 2,113
  7. ISCAR IL 1,516
  8. SIEMENS DE 1,459
  9. LINCOLN GLOBAL US 1,433
  10. KOBE STEEL JP 1,423