by applying additional compounds or means favouring the cutting, scarfing or desurfacing procedure

Introduced: September 1968

Title

Titles differ between systems:

IPC: by applying additional compounds or means favouring the cutting, scarfing, or desurfacing procedure

CPC: by applying additional compounds or means favouring the cutting, scarfing or desurfacing procedure

Full Title

Full titles differ between systems:

IPC:

Cutting, scarfing, or desurfacing by applying flames > by applying additional compounds or means favouring the cutting, scarfing, or desurfacing procedure

CPC:

Cutting, scarfing, or desurfacing by applying flames > by applying additional compounds or means favouring the cutting, scarfing or desurfacing procedure

No child classifications to compare. This is a leaf node in both IPC and CPC.