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DIFF Subclass Not Allocatable
B33Y

ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING

Introduced: January 2015

Description

B33Y covers additive manufacturing processes that build three-dimensional objects through successive deposition, agglomeration, or layering of material. This subclass encompasses technologies including 3D printing, stereolithography, selective laser sintering, and related layer-by-layer fabrication methods. The scope extends to apparatus, machines, process parameters, material handling systems, and post-processing techniques specific to additive manufacturing operations. This classification excludes non-additive manufacturing methods (such as subtractive machining or forming) and addresses the technical implementation of 3D object construction rather than the design or composition of the final products themselves.

Additional Content IPC

three-dimensional [3D] printing three-dimensional printing 3D printing additive manufacturing where the buildup of successive layers of material includes the use of a printer-like device having a servo-controlled head for dispensing materials that form the layers, similar to that used by inkjet printers stereolithography additive manufacturing technique where the successive layers of material are formed by selectively hardening regions of polymeric material successively applied to the structure, typically by the use of laser light

IPC and CPC are identically structured here. All 7 subcodes exist in both systems.

IPC defines codes here since 2015.

Child Classifications

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  • B33Y 10/00 Processes of additive manufacturing since 2015 IPC+CPC Available in IPC and CPC
  • B33Y 30/00 Apparatus for additive manufacturing; Details thereof or accessories therefor since 2015 IPC+CPC Available in IPC and CPC
  • B33Y 80/00 Products made by additive manufacturing since 2015 IPC+CPC Available in IPC and CPC
  • B33Y 99/00 Subject matter not provided for in other groups of this subclass since 2015 IPC+CPC Available in IPC and CPC

Top Applicants

Top Applicants (IPC)

Class B33,2013–2023, worldwide · Source: EPO PATSTAT

  1. HEWLETT-PACKARD DEVELOPMENT COMPANY US 3,558
  2. GE (GENERAL ELECTRIC COMPANY) US 1,721
  3. SEIKO EPSON CORPORATION 810
  4. XEROX CORPORATION US 787
  5. CHINESE ACADEMY OF SCIENCES 746
  6. SIEMENS DE 679
  7. RICOH COMPANY 624
  8. XIAN JIAOTONG UNIVERSITY 563
  9. HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY 550
  10. SOUTH CHINA UNIVERSITY OF TECHNOLOGY 522

Top Applicants (CPC)

Class B33,2013–2023, worldwide · Source: EPO PATSTAT

  1. HEWLETT-PACKARD DEVELOPMENT COMPANY US 4,417
  2. GE (GENERAL ELECTRIC COMPANY) US 2,451
  3. SIEMENS DE 1,136
  4. XEROX CORPORATION US 991
  5. BOEING COMPANY US 707
  6. SEIKO EPSON CORPORATION 672
  7. EOSELECTRO OPTICAL SYSTEMS DE 662
  8. GE (GENERAL ELECTRIC COMPANY) 659
  9. KINPO ELECTRONICS TW 621
  10. XYZPRINTING TW 618