DIFF Main Group
B33Y 50/00 Data acquisition or data processing for additive manufacturing
Introduced: January 2015
IPC and CPC are identically structured here. All 1 subcodes exist in both systems.
IPC defines codes here since 2015.
Child Classifications
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- B33Y 50/02 for controlling or regulating additive manufacturing processes since 2015 IPC+CPC Available in IPC and CPC
Top Applicants
Top Applicants (IPC)
Class B33,2013–2023, worldwide · Source: EPO PATSTAT
- HEWLETT-PACKARD DEVELOPMENT COMPANY US 3,558
- GE (GENERAL ELECTRIC COMPANY) US 1,721
- SEIKO EPSON CORPORATION 810
- XEROX CORPORATION US 787
- CHINESE ACADEMY OF SCIENCES 746
- SIEMENS DE 679
- RICOH COMPANY 624
- XIAN JIAOTONG UNIVERSITY 563
- HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY 550
- SOUTH CHINA UNIVERSITY OF TECHNOLOGY 522
Top Applicants (CPC)
Class B33,2013–2023, worldwide · Source: EPO PATSTAT
- HEWLETT-PACKARD DEVELOPMENT COMPANY US 4,417
- GE (GENERAL ELECTRIC COMPANY) US 2,451
- SIEMENS DE 1,136
- XEROX CORPORATION US 991
- BOEING COMPANY US 707
- SEIKO EPSON CORPORATION 672
- EOSELECTRO OPTICAL SYSTEMS DE 662
- GE (GENERAL ELECTRIC COMPANY) 659
- KINPO ELECTRONICS TW 621
- XYZPRINTING TW 618