DIFF Subgroup Additional Only
B81B 2207/115 Protective layers applied directly to the device before packaging
Full Title
Microstructural systems or auxiliary parts thereof > Structural features, others than packages, for protecting a device against environmental influences > Protective layers applied directly to the device before packaging
Top Applicants
Top Applicants (IPC)
Class B81,2013–2023, worldwide · Source: EPO PATSTAT
- ROBERT BOSCH DE 2,338
- INFINEON TECHNOLOGIES DE 702
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 691
- CHINESE ACADEMY OF SCIENCES 508
- CEA (COMMISSARIAT A L'ENERGIE ATOMIQUE) FR 507
- SEIKO EPSON CORPORATION 484
- HEWLETT-PACKARD DEVELOPMENT COMPANY US 439
- INVENSENSE US 378
- STMICROELECTRONICS IT 365
- FRAUNHOFER DE 337
Top Applicants (CPC)
Class B81,2013–2023, worldwide · Source: EPO PATSTAT
- ROBERT BOSCH DE 1,976
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 788
- INFINEON TECHNOLOGIES DE 759
- CEA (COMMISSARIAT A L'ENERGIE ATOMIQUE) FR 555
- STMICROELECTRONICS IT 526
- INVENSENSE US 430
- MURATA MANUFACTURING COMPANY JP 418
- SEIKO EPSON CORPORATION 338
- CHINESE ACADEMY OF SCIENCES 338
- FRAUNHOFER DE 297