DIFF Main Group
B81C 3/00 Assembling of devices or systems from individually processed components
Introduced: January 2000
Of 3 combined children, 0 exist in both systems.
3 codes are CPC-only extensions.
Child Classifications
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Top Applicants
Top Applicants (IPC)
Class B81,2013–2023, worldwide · Source: EPO PATSTAT
- ROBERT BOSCH DE 2,338
- INFINEON TECHNOLOGIES DE 702
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 691
- CHINESE ACADEMY OF SCIENCES 508
- CEA (COMMISSARIAT A L'ENERGIE ATOMIQUE) FR 507
- SEIKO EPSON CORPORATION 484
- HEWLETT-PACKARD DEVELOPMENT COMPANY US 439
- INVENSENSE US 378
- STMICROELECTRONICS IT 365
- FRAUNHOFER DE 337
Top Applicants (CPC)
Class B81,2013–2023, worldwide · Source: EPO PATSTAT
- ROBERT BOSCH DE 1,976
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 788
- INFINEON TECHNOLOGIES DE 759
- CEA (COMMISSARIAT A L'ENERGIE ATOMIQUE) FR 555
- STMICROELECTRONICS IT 526
- INVENSENSE US 430
- MURATA MANUFACTURING COMPANY JP 418
- SEIKO EPSON CORPORATION 338
- CHINESE ACADEMY OF SCIENCES 338
- FRAUNHOFER DE 297