IPC Main Group
B81C 3/00 Assembling of devices or systems from individually processed components
Introduced: January 2000
Last revised: January 2006
Classification Context
- Section:
- PERFORMING OPERATIONS; TRANSPORTING
- Class:
- MICROSTRUCTURAL TECHNOLOGY
- Subclass:
- PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
Top Applicants
Top 10 applicants by patent filingsfor class B81, 2013–2023, worldwide · Source: EPO PATSTAT
- ROBERT BOSCH DE 2,338
- INFINEON TECHNOLOGIES DE 702
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 691
- CHINESE ACADEMY OF SCIENCES 508
- CEA (COMMISSARIAT A L'ENERGIE ATOMIQUE) FR 507
- SEIKO EPSON CORPORATION 484
- HEWLETT-PACKARD DEVELOPMENT COMPANY US 439
- INVENSENSE US 378
- STMICROELECTRONICS IT 365
- FRAUNHOFER DE 337