C23C 16/458 characterised by the method used for supporting substrates in the reaction chamber
Introduced: January 2000
Full Title
Full titles differ between systems:
Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes > characterised by the method of coating > characterised by the method used for supporting substrates in the reaction chamber
Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes (reactive sputtering or vacuum evaporation C23C14/00) > characterised by the method of coating (C23C16/04 takes precedence) > characterised by the method used for supporting substrates in the reaction chamber
Of 2 combined children, 0 exist in both systems.
2 codes are CPC-only extensions.
Child Classifications
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Top Applicants
Top Applicants (IPC)
Class C23,2013–2023, worldwide · Source: EPO PATSTAT
- APPLIED MATERIALS US 8,096
- TOKYO ELECTRON JP 3,985
- CHINESE ACADEMY OF SCIENCES 2,842
- LAM RESEARCH CORPORATION US 2,654
- TOKYO ELECTRON 2,540
- NIPPON STEEL CORPORATION JP 2,465
- JFE STEEL JP 2,368
- ASM IP HOLDING NL 2,092
- APPLIED MATERIALS 1,877
- POSCO (POHANG IRON AND STEEL COMPANY) KR 1,782
Top Applicants (CPC)
Class C23,2013–2023, worldwide · Source: EPO PATSTAT
- APPLIED MATERIALS US 10,596
- TOKYO ELECTRON JP 5,229
- LAM RESEARCH CORPORATION US 3,622
- NIPPON STEEL CORPORATION JP 3,171
- JFE STEEL JP 3,128
- ASM IP HOLDING NL 2,722
- ARCELORMITTAL LU 2,481
- TOKYO ELECTRON 2,359
- APPLIED MATERIALS 2,284
- CHINESE ACADEMY OF SCIENCES 2,110