C23C 16/00 Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes (reactive sputtering or vacuum evaporation C23C14/00)
Introduced: January 1985
Title
Titles differ between systems:
IPC: Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
CPC: Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes (reactive sputtering or vacuum evaporation C23C14/00)
Full Title
Full titles differ between systems:
Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes (reactive sputtering or vacuum evaporation C23C14/00)
Of 9 combined children, 7 exist in both systems.
2 codes are CPC-only extensions.
3 shared codes have differing titles between IPC and CPC.
IPC defines codes here since 1985.
Child Classifications
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- C23C 16/01 on temporary substrates, e.g. substrates subsequently removed by etching since 2000 IPC+CPC Available in IPC and CPC
- C23C 16/02 Pretreatment of the material to be coated (C23C16/04 takes precedence) since 1985 +4 CPC IPC+CPC Available in IPC and CPC
- C23C 16/04 Coating on selected surface areas, e.g. using masks since 1985 +3 CPC IPC+CPC Available in IPC and CPC
- C23C 16/06 characterised by the deposition of metallic material since 1985 IPC+CPC Available in IPC and CPC
- C23C 16/22 characterised by the deposition of inorganic material, other than metallic material since 1985 IPC+CPC Available in IPC and CPC
- C23C 16/44 characterised by the method of coating (C23C16/04 takes precedence) since 1985 +7 CPC IPC+CPC Available in IPC and CPC
Top Applicants
Top Applicants (IPC)
Class C23,2013–2023, worldwide · Source: EPO PATSTAT
- APPLIED MATERIALS US 8,096
- TOKYO ELECTRON JP 3,985
- CHINESE ACADEMY OF SCIENCES 2,842
- LAM RESEARCH CORPORATION US 2,654
- TOKYO ELECTRON 2,540
- NIPPON STEEL CORPORATION JP 2,465
- JFE STEEL JP 2,368
- ASM IP HOLDING NL 2,092
- APPLIED MATERIALS 1,877
- POSCO (POHANG IRON AND STEEL COMPANY) KR 1,782
Top Applicants (CPC)
Class C23,2013–2023, worldwide · Source: EPO PATSTAT
- APPLIED MATERIALS US 10,596
- TOKYO ELECTRON JP 5,229
- LAM RESEARCH CORPORATION US 3,622
- NIPPON STEEL CORPORATION JP 3,171
- JFE STEEL JP 3,128
- ASM IP HOLDING NL 2,722
- ARCELORMITTAL LU 2,481
- TOKYO ELECTRON 2,359
- APPLIED MATERIALS 2,284
- CHINESE ACADEMY OF SCIENCES 2,110