DIFF Subgroup
G06F 30/33 Design verification, e.g. functional simulation or model checking
Introduced: January 2020
Full Title
Full titles differ between systems:
IPC:
Computer-aided design [CAD] > Circuit design > Circuit design at the digital level > Design verification, e.g. functional simulation or model checking
CPC:
Computer-aided design [CAD] > Circuit design > Circuit design at the digital level (reconfigurable circuits G06F30/34) > Design verification, e.g. functional simulation or model checking
IPC and CPC are identically structured here. All 3 subcodes exist in both systems.
IPC defines codes here since 2020.
Child Classifications
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- G06F 30/3323 using formal methods, e.g. equivalence checking or property checking since 2020 IPC+CPC Available in IPC and CPC
Top Applicants
Top Applicants (IPC)
Class G06,2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 66,669
- IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 62,313
- MICROSOFT TECHNOLOGY LICENSING US 41,918
- GOOGLE US 32,969
- SGCC(STATE GRID CORPORATION OF CHINA) 30,822
- INTEL CORPORATION US 30,010
- TENCENT TECHNOLOGY (SHENZHEN) COMPANY 28,235
- HUAWEI TECHNOLOGIES COMPANY CN 26,079
- APPLE US 21,891
- HUAWEI TECHNOLOGIES COMPANY 20,505
Top Applicants (CPC)
Class G06,2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 76,952
- IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 62,841
- MICROSOFT TECHNOLOGY LICENSING US 44,778
- GOOGLE US 35,735
- INTEL CORPORATION US 32,087
- HUAWEI TECHNOLOGIES COMPANY CN 30,572
- TENCENT TECHNOLOGY (SHENZHEN) COMPANY 25,023
- APPLE US 23,482
- SGCC(STATE GRID CORPORATION OF CHINA) 22,548
- HUAWEI TECHNOLOGIES COMPANY 20,917