Recording by mechanical cutting, deforming or pressing, e.g. of grooves or pits; Reproducing by mechanical sensing; Record carriers therefor (G11B11/00, take precedence)

Introduced: September 1968

Title

Titles differ between systems:

IPC: Recording by mechanical cutting, deforming or pressing, e.g. of grooves or pits; Reproducing by mechanical sensing; Record carriers therefor

CPC: Recording by mechanical cutting, deforming or pressing, e.g. of grooves or pits; Reproducing by mechanical sensing; Record carriers therefor (G11B11/00, take precedence)

Full Title

Full titles differ between systems:

IPC:

Recording by mechanical cutting, deforming or pressing, e.g. of grooves or pits; Reproducing by mechanical sensing; Record carriers therefor

CPC:

Recording by mechanical cutting, deforming or pressing, e.g. of grooves or pits; Reproducing by mechanical sensing; Record carriers therefor (G11B11/00, take precedence)

Of 11 combined children, 7 exist in both systems.

4 codes are CPC-only extensions.

Child Classifications

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G11B 3/001 +1 CPC CPC only CPC only
G11B 3/003 +2 CPC CPC only CPC only
G11B 3/007 CPC only CPC only
G11B 3/008 CPC only CPC only
G11B 3/02 Arrangements of heads IPC+CPC Available in IPC and CPC
G11B 3/44 Styli, e.g. sapphire, diamond +1 CPC IPC+CPC Available in IPC and CPC
G11B 3/58 Cleaning record carriers or styli, e.g. removing shavings or dust +2 CPC IPC+CPC Available in IPC and CPC
G11B 3/60 Turntables for record carriers IPC+CPC Available in IPC and CPC
G11B 3/64 Re-recording, i.e. transcribing information from one grooved record carrier on to one or more similar or dissimilar record carriers IPC+CPC Available in IPC and CPC
G11B 3/66 Erasing information, e.g. for reuse of record carrier IPC+CPC Available in IPC and CPC
G11B 3/68 Record carriers +3 CPC IPC+CPC Available in IPC and CPC

Top Applicants

Top Applicants (IPC)

Class G11,2013–2023, worldwide · Source: EPO PATSTAT

MICRON TECHNOLOGY US 10,574
SK HYNIX KR 9,138
SAMSUNG ELECTRONICS COMPANY KR 9,004
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 3,739
IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 3,443
INTEL CORPORATION US 2,952
SANDISK TECHNOLOGIES US 2,905
WESTERN DIGITAL TECHNOLOGIES US 2,630
TOSHIBA CORPORATION JP 2,593
SEAGATE TECHNOLOGY US 2,472

Top Applicants (CPC)

Class G11,2013–2023, worldwide · Source: EPO PATSTAT

MICRON TECHNOLOGY US 12,397
SAMSUNG ELECTRONICS COMPANY KR 12,238
SK HYNIX KR 11,371
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 4,601
INTEL CORPORATION US 3,874
IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 3,866
SANDISK TECHNOLOGIES US 3,151
SK HYNIX 3,143
SAMSUNG ELECTRONICS COMPANY 3,073
WESTERN DIGITAL TECHNOLOGIES US 2,961