DIFF Subgroup
G11B 3/44 Styli, e.g. sapphire, diamond
Introduced: September 1968
Full Title
Full titles differ between systems:
IPC:
Recording by mechanical cutting, deforming or pressing, e.g. of grooves or pits; Reproducing by mechanical sensing; Record carriers therefor > Styli, e.g. sapphire, diamond
CPC:
Recording by mechanical cutting, deforming or pressing, e.g. of grooves or pits; Reproducing by mechanical sensing; Record carriers therefor (G11B11/00, take precedence) > Styli, e.g. sapphire, diamond
Of 6 combined children, 5 exist in both systems.
1 codes are CPC-only extensions.
2 shared codes have differing titles between IPC and CPC.
Child Classifications
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- G11B 3/46 Constructions or forms , e.g. attachment of point to shank IPC+CPC Available in IPC and CPC
- G11B 3/52 Arrangements permitting styli to yield under excessive pressure IPC+CPC Available in IPC and CPC
- G11B 3/54 Storing; Manipulating, e.g. feeding styli to and from heads IPC+CPC Available in IPC and CPC
Top Applicants
Top Applicants (IPC)
Class G11,2013–2023, worldwide · Source: EPO PATSTAT
- MICRON TECHNOLOGY US 10,574
- SK HYNIX KR 9,138
- SAMSUNG ELECTRONICS COMPANY KR 9,004
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 3,739
- IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 3,443
- INTEL CORPORATION US 2,952
- SANDISK TECHNOLOGIES US 2,905
- WESTERN DIGITAL TECHNOLOGIES US 2,630
- TOSHIBA CORPORATION JP 2,593
- SEAGATE TECHNOLOGY US 2,472
Top Applicants (CPC)
Class G11,2013–2023, worldwide · Source: EPO PATSTAT
- MICRON TECHNOLOGY US 12,397
- SAMSUNG ELECTRONICS COMPANY KR 12,238
- SK HYNIX KR 11,371
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 4,601
- INTEL CORPORATION US 3,874
- IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 3,866
- SANDISK TECHNOLOGIES US 3,151
- SK HYNIX 3,143
- SAMSUNG ELECTRONICS COMPANY 3,073
- WESTERN DIGITAL TECHNOLOGIES US 2,961