G11B 5/127 Structure or manufacture of heads, e.g. inductive
Introduced: January 1985
Full Title
Full titles differ between systems:
Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor > Structure or manufacture of heads, e.g. inductive
Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor (G11B11/00 take precedence) > Structure or manufacture of heads, e.g. inductive
Of 12 combined children, 9 exist in both systems.
3 codes are CPC-only extensions.
5 shared codes have differing titles between IPC and CPC.
IPC defines codes here since 1985.
Child Classifications
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- G11B 5/133 with cores composed of particles, e.g. with dust cores, with ferrite cores since 1985 +1 CPC IPC+CPC Available in IPC and CPC
- G11B 5/147 with cores being composed of metal sheets, i.e. laminated cores since 1985 +1 CPC IPC+CPC Available in IPC and CPC
- G11B 5/187 Structure or manufacture of the surface of the head in physical contact with, or immediately adjacent to the recording medium; Pole pieces; Gap features (G11B5/265, , G11B5/31 take precedence) since 1985 +2 CPC IPC+CPC Available in IPC and CPC
- G11B 5/265 Structure or manufacture of a head with more than one gap for erasing, recording or reproducing on the same track (G11B5/33 takes precedence ) since 1985 +2 CPC IPC+CPC Available in IPC and CPC
- G11B 5/29 Structure or manufacture of unitary devices formed of plural heads for more than one track since 1985 +1 CPC IPC+CPC Available in IPC and CPC
- G11B 5/325 Erasing heads using permanent magnets (general details therefor G11B5/133 - G11B5/255) since 1985 IPC+CPC Available in IPC and CPC
- G11B 5/33 Structure or manufacture of flux-sensitive heads, ( ; general details therefor G11B5/133 - G11B5/255) since 1985 +1 CPC IPC+CPC Available in IPC and CPC
Top Applicants
Top Applicants (IPC)
Class G11,2013–2023, worldwide · Source: EPO PATSTAT
- MICRON TECHNOLOGY US 10,574
- SK HYNIX KR 9,138
- SAMSUNG ELECTRONICS COMPANY KR 9,004
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 3,739
- IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 3,443
- INTEL CORPORATION US 2,952
- SANDISK TECHNOLOGIES US 2,905
- WESTERN DIGITAL TECHNOLOGIES US 2,630
- TOSHIBA CORPORATION JP 2,593
- SEAGATE TECHNOLOGY US 2,472
Top Applicants (CPC)
Class G11,2013–2023, worldwide · Source: EPO PATSTAT
- MICRON TECHNOLOGY US 12,397
- SAMSUNG ELECTRONICS COMPANY KR 12,238
- SK HYNIX KR 11,371
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 4,601
- INTEL CORPORATION US 3,874
- IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 3,866
- SANDISK TECHNOLOGIES US 3,151
- SK HYNIX 3,143
- SAMSUNG ELECTRONICS COMPANY 3,073
- WESTERN DIGITAL TECHNOLOGIES US 2,961