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DIFF Subgroup
G11B 5/187

Structure or manufacture of the surface of the head in physical contact with, or immediately adjacent to the recording medium; Pole pieces; Gap features (G11B5/265, , G11B5/31 take precedence)

Introduced: January 1985

Title

Titles differ between systems:

IPC: Structure or manufacture of the surface of the head in physical contact with, or immediately adjacent to, the recording medium; Pole pieces; Gap features

CPC: Structure or manufacture of the surface of the head in physical contact with, or immediately adjacent to the recording medium; Pole pieces; Gap features (G11B5/265, , G11B5/31 take precedence)

Full Title

Full titles differ between systems:

IPC:

Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor > Structure or manufacture of heads, e.g. inductive > Structure or manufacture of the surface of the head in physical contact with, or immediately adjacent to, the recording medium; Pole pieces; Gap features

CPC:

Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor (G11B11/00 take precedence) > Structure or manufacture of heads, e.g. inductive > Structure or manufacture of the surface of the head in physical contact with, or immediately adjacent to the recording medium; Pole pieces; Gap features (G11B5/265, , G11B5/31 take precedence)

Of 7 combined children, 5 exist in both systems.

2 codes are CPC-only extensions.

1 shared codes have differing titles between IPC and CPC.

IPC defines codes here since 1985.

Child Classifications

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  • G11B 5/193 the pole pieces being ferrite since 1985 IPC+CPC Available in IPC and CPC
  • G11B 5/21 the pole pieces being of ferrous sheet metal since 1985 IPC+CPC Available in IPC and CPC
  • G11B 5/255 comprising means for protection against wear since 1985 IPC+CPC Available in IPC and CPC

Top Applicants

Top Applicants (IPC)

Class G11,2013–2023, worldwide · Source: EPO PATSTAT

  1. MICRON TECHNOLOGY US 10,574
  2. SK HYNIX KR 9,138
  3. SAMSUNG ELECTRONICS COMPANY KR 9,004
  4. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 3,739
  5. IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 3,443
  6. INTEL CORPORATION US 2,952
  7. SANDISK TECHNOLOGIES US 2,905
  8. WESTERN DIGITAL TECHNOLOGIES US 2,630
  9. TOSHIBA CORPORATION JP 2,593
  10. SEAGATE TECHNOLOGY US 2,472

Top Applicants (CPC)

Class G11,2013–2023, worldwide · Source: EPO PATSTAT

  1. MICRON TECHNOLOGY US 12,397
  2. SAMSUNG ELECTRONICS COMPANY KR 12,238
  3. SK HYNIX KR 11,371
  4. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 4,601
  5. INTEL CORPORATION US 3,874
  6. IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 3,866
  7. SANDISK TECHNOLOGIES US 3,151
  8. SK HYNIX 3,143
  9. SAMSUNG ELECTRONICS COMPANY 3,073
  10. WESTERN DIGITAL TECHNOLOGIES US 2,961