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DIFF Subgroup
G11B 7/124

the integrated head arrangements including waveguides

Introduced: January 2012

Full Title

Full titles differ between systems:

IPC:

Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation, reproducing using an optical beam at lower power; Record carriers therefor > Heads, e.g. forming of the optical beam spot or modulation of the optical beam > Integrated head arrangements, e.g. with source and detectors mounted on the same substrate > the integrated head arrangements including waveguides

CPC:

Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation , reproducing using an optical beam at lower power ; Record carriers therefor (G11B11/00, G11B13/00 take precedence) > Heads, e.g. forming of the optical beam spot or modulation of the optical beam (disposition or mounting of head elements within housing or with provision for moving of light source, optical beam or detector, irrelevant to the transducing method G11B7/08 ) > Integrated head arrangements, e.g. with source and detectors mounted on the same substrate > the integrated head arrangements including waveguides

IPC and CPC are identically structured here. All 1 subcodes exist in both systems.

IPC defines codes here since 2012.

Child Classifications

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  • G11B 7/1245 the waveguides including means for electro-optical or acousto-optical deflection since 2012 IPC+CPC Available in IPC and CPC

Top Applicants

Top Applicants (IPC)

Class G11,2013–2023, worldwide · Source: EPO PATSTAT

  1. MICRON TECHNOLOGY US 10,574
  2. SK HYNIX KR 9,138
  3. SAMSUNG ELECTRONICS COMPANY KR 9,004
  4. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 3,739
  5. IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 3,443
  6. INTEL CORPORATION US 2,952
  7. SANDISK TECHNOLOGIES US 2,905
  8. WESTERN DIGITAL TECHNOLOGIES US 2,630
  9. TOSHIBA CORPORATION JP 2,593
  10. SEAGATE TECHNOLOGY US 2,472

Top Applicants (CPC)

Class G11,2013–2023, worldwide · Source: EPO PATSTAT

  1. MICRON TECHNOLOGY US 12,397
  2. SAMSUNG ELECTRONICS COMPANY KR 12,238
  3. SK HYNIX KR 11,371
  4. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 4,601
  5. INTEL CORPORATION US 3,874
  6. IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 3,866
  7. SANDISK TECHNOLOGIES US 3,151
  8. SK HYNIX 3,143
  9. SAMSUNG ELECTRONICS COMPANY 3,073
  10. WESTERN DIGITAL TECHNOLOGIES US 2,961