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DIFF Subgroup
G11B 7/1372

Lenses

Introduced: January 2012

Full Title

Full titles differ between systems:

IPC:

Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation, reproducing using an optical beam at lower power; Record carriers therefor > Heads, e.g. forming of the optical beam spot or modulation of the optical beam > Means for guiding the beam from the source to the record carrier or from the record carrier to the detector > Lenses

CPC:

Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation , reproducing using an optical beam at lower power ; Record carriers therefor (G11B11/00, G11B13/00 take precedence) > Heads, e.g. forming of the optical beam spot or modulation of the optical beam (disposition or mounting of head elements within housing or with provision for moving of light source, optical beam or detector, irrelevant to the transducing method G11B7/08 ) > Means for guiding the beam from the source to the record carrier or from the record carrier to the detector > Lenses

Of 6 combined children, 3 exist in both systems.

3 codes are CPC-only extensions.

Note: 3 CPC extensions are marked as secondary classification only.

IPC defines codes here since 2012.

Child Classifications

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  • G11B 2007/13722 2nd only CPC only CPC only
  • G11B 2007/13725 2nd only CPC only CPC only
  • G11B 2007/13727 2nd only CPC only CPC only
  • G11B 7/1374 Objective lenses since 2012 IPC+CPC Available in IPC and CPC
  • G11B 7/1376 Collimator lenses since 2012 IPC+CPC Available in IPC and CPC
  • G11B 7/1378 Separate aberration correction lenses; Cylindrical lenses to generate astigmatism; Beam expanders since 2012 IPC+CPC Available in IPC and CPC

Top Applicants

Top Applicants (IPC)

Class G11,2013–2023, worldwide · Source: EPO PATSTAT

  1. MICRON TECHNOLOGY US 10,574
  2. SK HYNIX KR 9,138
  3. SAMSUNG ELECTRONICS COMPANY KR 9,004
  4. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 3,739
  5. IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 3,443
  6. INTEL CORPORATION US 2,952
  7. SANDISK TECHNOLOGIES US 2,905
  8. WESTERN DIGITAL TECHNOLOGIES US 2,630
  9. TOSHIBA CORPORATION JP 2,593
  10. SEAGATE TECHNOLOGY US 2,472

Top Applicants (CPC)

Class G11,2013–2023, worldwide · Source: EPO PATSTAT

  1. MICRON TECHNOLOGY US 12,397
  2. SAMSUNG ELECTRONICS COMPANY KR 12,238
  3. SK HYNIX KR 11,371
  4. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 4,601
  5. INTEL CORPORATION US 3,874
  6. IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 3,866
  7. SANDISK TECHNOLOGIES US 3,151
  8. SK HYNIX 3,143
  9. SAMSUNG ELECTRONICS COMPANY 3,073
  10. WESTERN DIGITAL TECHNOLOGIES US 2,961