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PCE
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DIFF Subgroup
G11B 7/24018

Laminated discs (G11B7/24015 takes precedence)

Introduced: January 2013

Title

Titles differ between systems:

IPC: Laminated discs

CPC: Laminated discs (G11B7/24015 takes precedence)

Full Title

Full titles differ between systems:

IPC:

Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation, reproducing using an optical beam at lower power; Record carriers therefor > Record carriers characterised by shape, structure or physical properties, or by the selection of the material > Laminated discs

CPC:

Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation , reproducing using an optical beam at lower power ; Record carriers therefor (G11B11/00, G11B13/00 take precedence) > Record carriers characterised by shape, structure or physical properties, or by the selection of the material (characterised by the arrangement of information on the carrier G11B7/007) > Laminated discs (G11B7/24015 takes precedence)

IPC and CPC are identically structured here. All 3 subcodes exist in both systems.

1 shared codes have differing titles between IPC and CPC.

IPC defines codes here since 2013.

Child Classifications

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  • G11B 7/24021 provided with a special shape or structure for centering or eccentricity prevention, e.g. alignment since 2013 IPC+CPC Available in IPC and CPC
  • G11B 7/24024 Adhesion or bonding, e.g. specific adhesive layers since 2013 IPC+CPC Available in IPC and CPC
  • G11B 7/24027 Layers; Shape, structure or physical properties thereof (G11B7/24021, G11B7/24024 take precedence) since 2013 IPC+CPC Available in IPC and CPC

Top Applicants

Top Applicants (IPC)

Class G11,2013–2023, worldwide · Source: EPO PATSTAT

  1. MICRON TECHNOLOGY US 10,574
  2. SK HYNIX KR 9,138
  3. SAMSUNG ELECTRONICS COMPANY KR 9,004
  4. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 3,739
  5. IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 3,443
  6. INTEL CORPORATION US 2,952
  7. SANDISK TECHNOLOGIES US 2,905
  8. WESTERN DIGITAL TECHNOLOGIES US 2,630
  9. TOSHIBA CORPORATION JP 2,593
  10. SEAGATE TECHNOLOGY US 2,472

Top Applicants (CPC)

Class G11,2013–2023, worldwide · Source: EPO PATSTAT

  1. MICRON TECHNOLOGY US 12,397
  2. SAMSUNG ELECTRONICS COMPANY KR 12,238
  3. SK HYNIX KR 11,371
  4. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 4,601
  5. INTEL CORPORATION US 3,874
  6. IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 3,866
  7. SANDISK TECHNOLOGIES US 3,151
  8. SK HYNIX 3,143
  9. SAMSUNG ELECTRONICS COMPANY 3,073
  10. WESTERN DIGITAL TECHNOLOGIES US 2,961