G11B 7/2403 Layers; Shape, structure or physical properties thereof
Introduced: January 2013
Full Title
Full titles differ between systems:
Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation, reproducing using an optical beam at lower power; Record carriers therefor > Record carriers characterised by shape, structure or physical properties, or by the selection of the material > Layers; Shape, structure or physical properties thereof
Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation , reproducing using an optical beam at lower power ; Record carriers therefor (G11B11/00, G11B13/00 take precedence) > Record carriers characterised by shape, structure or physical properties, or by the selection of the material (characterised by the arrangement of information on the carrier G11B7/007) > Layers; Shape, structure or physical properties thereof
IPC and CPC are identically structured here. All 8 subcodes exist in both systems.
2 shared codes have differing titles between IPC and CPC.
IPC defines codes here since 2013.
Child Classifications
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- G11B 7/24035 Recording layers (substrates also used as recording layers G11B7/24047) since 2013 IPC+CPC Available in IPC and CPC
- G11B 7/24053 Protective topcoat layers lying opposite to the light entrance side, e.g. layers for preventing electrostatic charging since 2013 IPC+CPC Available in IPC and CPC
- G11B 7/24056 Light transmission layers lying on the light entrance side and being thinner than the substrate, e.g. specially adapted for Blu-ray® discs since 2013 IPC+CPC Available in IPC and CPC
- G11B 7/24065 Layers assisting in recording or reproduction below the optical diffraction limit, e.g. non-linear optical layers or structures (cover layers for near-field media G11B7/24059) since 2013 IPC+CPC Available in IPC and CPC
- G11B 7/24067 Combinations of two or more layers with specific interrelation since 2013 IPC+CPC Available in IPC and CPC
Top Applicants
Top Applicants (IPC)
Class G11,2013–2023, worldwide · Source: EPO PATSTAT
- MICRON TECHNOLOGY US 10,574
- SK HYNIX KR 9,138
- SAMSUNG ELECTRONICS COMPANY KR 9,004
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 3,739
- IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 3,443
- INTEL CORPORATION US 2,952
- SANDISK TECHNOLOGIES US 2,905
- WESTERN DIGITAL TECHNOLOGIES US 2,630
- TOSHIBA CORPORATION JP 2,593
- SEAGATE TECHNOLOGY US 2,472
Top Applicants (CPC)
Class G11,2013–2023, worldwide · Source: EPO PATSTAT
- MICRON TECHNOLOGY US 12,397
- SAMSUNG ELECTRONICS COMPANY KR 12,238
- SK HYNIX KR 11,371
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 4,601
- INTEL CORPORATION US 3,874
- IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 3,866
- SANDISK TECHNOLOGIES US 3,151
- SK HYNIX 3,143
- SAMSUNG ELECTRONICS COMPANY 3,073
- WESTERN DIGITAL TECHNOLOGIES US 2,961