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DIFF Subgroup
G11B 7/24065

Layers assisting in recording or reproduction below the optical diffraction limit, e.g. non-linear optical layers or structures (cover layers for near-field media G11B7/24059)

Introduced: January 2013

Title

Titles differ between systems:

IPC: Layers assisting in recording or reproduction below the optical diffraction limit, e.g. non-linear optical layers or structures

CPC: Layers assisting in recording or reproduction below the optical diffraction limit, e.g. non-linear optical layers or structures (cover layers for near-field media G11B7/24059)

Full Title

Full titles differ between systems:

IPC:

Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation, reproducing using an optical beam at lower power; Record carriers therefor > Record carriers characterised by shape, structure or physical properties, or by the selection of the material > Layers; Shape, structure or physical properties thereof > Layers assisting in recording or reproduction below the optical diffraction limit, e.g. non-linear optical layers or structures

CPC:

Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation , reproducing using an optical beam at lower power ; Record carriers therefor (G11B11/00, G11B13/00 take precedence) > Record carriers characterised by shape, structure or physical properties, or by the selection of the material (characterised by the arrangement of information on the carrier G11B7/007) > Layers; Shape, structure or physical properties thereof > Layers assisting in recording or reproduction below the optical diffraction limit, e.g. non-linear optical layers or structures (cover layers for near-field media G11B7/24059)

No child classifications to compare. This is a leaf node in both IPC and CPC.

Top Applicants

Top Applicants (IPC)

Class G11,2013–2023, worldwide · Source: EPO PATSTAT

  1. MICRON TECHNOLOGY US 10,574
  2. SK HYNIX KR 9,138
  3. SAMSUNG ELECTRONICS COMPANY KR 9,004
  4. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 3,739
  5. IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 3,443
  6. INTEL CORPORATION US 2,952
  7. SANDISK TECHNOLOGIES US 2,905
  8. WESTERN DIGITAL TECHNOLOGIES US 2,630
  9. TOSHIBA CORPORATION JP 2,593
  10. SEAGATE TECHNOLOGY US 2,472

Top Applicants (CPC)

Class G11,2013–2023, worldwide · Source: EPO PATSTAT

  1. MICRON TECHNOLOGY US 12,397
  2. SAMSUNG ELECTRONICS COMPANY KR 12,238
  3. SK HYNIX KR 11,371
  4. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 4,601
  5. INTEL CORPORATION US 3,874
  6. IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 3,866
  7. SANDISK TECHNOLOGIES US 3,151
  8. SK HYNIX 3,143
  9. SAMSUNG ELECTRONICS COMPANY 3,073
  10. WESTERN DIGITAL TECHNOLOGIES US 2,961