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DIFF Subgroup
H01C 17/06

adapted for coating resistive material on a base

Introduced: July 1974

Full Title

Full titles differ between systems:

IPC:

Apparatus or processes specially adapted for manufacturing resistors > adapted for coating resistive material on a base

CPC:

Apparatus or processes specially adapted for manufacturing resistors (providing fillings for housings or enclosures H01C1/02; reducing insulation surrounding a resistor to powder H01C1/03; manufacture of thermally variable resistors H01C7/02, H01C7/04) > adapted for coating resistive material on a base

IPC and CPC are identically structured here. All 4 subcodes exist in both systems.

1 shared codes have differing titles between IPC and CPC.

IPC defines codes here since 1974.

Child Classifications

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  • H01C 17/07 by resistor foil bonding, e.g. cladding since 1995 IPC+CPC Available in IPC and CPC
  • H01C 17/20 by pyrolytic processes since 1974 IPC+CPC Available in IPC and CPC

Top Applicants

Top Applicants (IPC)

Class H01,2013–2023, worldwide · Source: EPO PATSTAT

  1. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 43,574
  2. SAMSUNG ELECTRONICS COMPANY KR 42,206
  3. LG CHEM KR 21,383
  4. APPLIED MATERIALS US 20,441
  5. LG ENERGY SOLUTION KR 20,279
  6. SAMSUNG DISPLAY KR 19,725
  7. CHINESE ACADEMY OF SCIENCES 19,400
  8. TOYOTA MOTOR CORPORATION 18,819
  9. SGCC(STATE GRID CORPORATION OF CHINA) 18,082
  10. TOKYO ELECTRON JP 17,634

Top Applicants (CPC)

Class H01,2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG ELECTRONICS COMPANY KR 37,897
  2. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
  3. APPLIED MATERIALS US 21,640
  4. LG ENERGY SOLUTION KR 20,770
  5. LG CHEM KR 19,835
  6. TOKYO ELECTRON JP 18,519
  7. ROBERT BOSCH DE 14,595
  8. INTEL CORPORATION US 13,580
  9. MURATA MANUFACTURING COMPANY JP 12,151
  10. SAMSUNG SDI COMPANY KR 12,080