DIFF Main Group
H01R 13/00 Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
Introduced: September 1968
Title
Titles differ between systems:
IPC: Details of coupling devices of the kinds covered by groups or
CPC: Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
Full Title
Full titles differ between systems:
IPC:
Details of coupling devices of the kinds covered by groups or
CPC:
Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
Of 15 combined children, 14 exist in both systems.
1 codes are CPC-only extensions.
4 shared codes have differing titles between IPC and CPC.
Child Classifications
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- H01R 13/40 Securing contact members in or to a base or case; Insulating of contact members IPC+CPC Available in IPC and CPC
- H01R 13/56 Means for preventing chafing or fracture of flexible leads at outlet from coupling part +3 CPC IPC+CPC Available in IPC and CPC
- H01R 13/58 Means for relieving strain on wire connection, e.g. cord grip +6 CPC IPC+CPC Available in IPC and CPC
- H01R 13/62 Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement +1 CPC IPC+CPC Available in IPC and CPC
- H01R 13/646 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match (non-coaxed protective earth or shield arrangements H01R13/648; coaxed connectors specially adapted for high frequency H01R24/40) since 2000 IPC+CPC Available in IPC and CPC
- H01R 13/648 Protective earth or shield arrangements on coupling devices (coaxially arranged shields H01R24/38) since 1980 +1 CPC IPC+CPC Available in IPC and CPC
- H01R 13/66 Structural association with built-in electrical component (coupling devices having concentrically or coaxially-arranged contacts H01R24/38) +2 CPC IPC+CPC Available in IPC and CPC
- H01R 13/73 Means for mounting coupling parts to apparatus or structures, e.g. to a wall since 1985 IPC+CPC Available in IPC and CPC
Top Applicants
Top Applicants (IPC)
Class H01,2013–2023, worldwide · Source: EPO PATSTAT
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 43,574
- SAMSUNG ELECTRONICS COMPANY KR 42,206
- LG CHEM KR 21,383
- APPLIED MATERIALS US 20,441
- LG ENERGY SOLUTION KR 20,279
- SAMSUNG DISPLAY KR 19,725
- CHINESE ACADEMY OF SCIENCES 19,400
- TOYOTA MOTOR CORPORATION 18,819
- SGCC(STATE GRID CORPORATION OF CHINA) 18,082
- TOKYO ELECTRON JP 17,634
Top Applicants (CPC)
Class H01,2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 37,897
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
- APPLIED MATERIALS US 21,640
- LG ENERGY SOLUTION KR 20,770
- LG CHEM KR 19,835
- TOKYO ELECTRON JP 18,519
- ROBERT BOSCH DE 14,595
- INTEL CORPORATION US 13,580
- MURATA MANUFACTURING COMPANY JP 12,151
- SAMSUNG SDI COMPANY KR 12,080