Skip to content
PCE
Search Classifications
Search for IPC and CPC classification codes or keywords
DIFF Subgroup
H01R 11/03

characterised by the relationship between the connecting locations (H01R11/11 takes precedence)

Introduced: January 1980

Title

Titles differ between systems:

IPC: characterised by the type of the connecting locations on the individual element or by the type of the connections between the connecting locations and the conductive members

CPC: characterised by the relationship between the connecting locations (H01R11/11 takes precedence)

Full Title

Full titles differ between systems:

IPC:

Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts > characterised by the type of the connecting locations on the individual element or by the type of the connections between the connecting locations and the conductive members

CPC:

Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts > characterised by the relationship between the connecting locations (H01R11/11 takes precedence)

IPC and CPC are identically structured here. All 3 subcodes exist in both systems.

IPC defines codes here since 1980.

Child Classifications

Navigate with arrow keys, Enter to open

  • H01R 11/05 the connecting locations having different types of direct connections since 1980 IPC+CPC Available in IPC and CPC
  • H01R 11/07 the connecting locations being of the same type but different sizes since 1980 IPC+CPC Available in IPC and CPC
  • H01R 11/09 the connecting locations being identical since 1980 IPC+CPC Available in IPC and CPC

Top Applicants

Top Applicants (IPC)

Class H01,2013–2023, worldwide · Source: EPO PATSTAT

  1. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 43,574
  2. SAMSUNG ELECTRONICS COMPANY KR 42,206
  3. LG CHEM KR 21,383
  4. APPLIED MATERIALS US 20,441
  5. LG ENERGY SOLUTION KR 20,279
  6. SAMSUNG DISPLAY KR 19,725
  7. CHINESE ACADEMY OF SCIENCES 19,400
  8. TOYOTA MOTOR CORPORATION 18,819
  9. SGCC(STATE GRID CORPORATION OF CHINA) 18,082
  10. TOKYO ELECTRON JP 17,634

Top Applicants (CPC)

Class H01,2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG ELECTRONICS COMPANY KR 37,897
  2. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
  3. APPLIED MATERIALS US 21,640
  4. LG ENERGY SOLUTION KR 20,770
  5. LG CHEM KR 19,835
  6. TOKYO ELECTRON JP 18,519
  7. ROBERT BOSCH DE 14,595
  8. INTEL CORPORATION US 13,580
  9. MURATA MANUFACTURING COMPANY JP 12,151
  10. SAMSUNG SDI COMPANY KR 12,080