H01R 11/11 End pieces or tapping pieces for wires, supported by the wire and for facilitating electrical connection to some other wire, terminal or conductive member (H01R11/01 takes precedence)
Introduced: January 1980
Title
Titles differ between systems:
IPC: End pieces or tapping pieces for wires or cables, supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member
CPC: End pieces or tapping pieces for wires, supported by the wire and for facilitating electrical connection to some other wire, terminal or conductive member (H01R11/01 takes precedence)
Full Title
Full titles differ between systems:
Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts > End pieces or tapping pieces for wires or cables, supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member
Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts > End pieces or tapping pieces for wires, supported by the wire and for facilitating electrical connection to some other wire, terminal or conductive member (H01R11/01 takes precedence)
IPC and CPC are identically structured here. All 9 subcodes exist in both systems.
Child Classifications
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- H01R 11/20 End pieces terminating in a needle point or analogous contact for penetrating insulation or cable strands IPC+CPC Available in IPC and CPC
Top Applicants
Top Applicants (IPC)
Class H01,2013–2023, worldwide · Source: EPO PATSTAT
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 43,574
- SAMSUNG ELECTRONICS COMPANY KR 42,206
- LG CHEM KR 21,383
- APPLIED MATERIALS US 20,441
- LG ENERGY SOLUTION KR 20,279
- SAMSUNG DISPLAY KR 19,725
- CHINESE ACADEMY OF SCIENCES 19,400
- TOYOTA MOTOR CORPORATION 18,819
- SGCC(STATE GRID CORPORATION OF CHINA) 18,082
- TOKYO ELECTRON JP 17,634
Top Applicants (CPC)
Class H01,2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 37,897
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
- APPLIED MATERIALS US 21,640
- LG ENERGY SOLUTION KR 20,770
- LG CHEM KR 19,835
- TOKYO ELECTRON JP 18,519
- ROBERT BOSCH DE 14,595
- INTEL CORPORATION US 13,580
- MURATA MANUFACTURING COMPANY JP 12,151
- SAMSUNG SDI COMPANY KR 12,080