Pins, blades or sockets having separate spring member for producing or increasing contact pressure

Introduced: January 1980

Full Title

Full titles differ between systems:

IPC:

Details of coupling devices of the kinds covered by groups or > Contact members > Pins, blades or sockets having separate spring member for producing or increasing contact pressure

CPC:

Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 > Contact members > Pins, blades or sockets having separate spring member for producing or increasing contact pressure

IPC and CPC are identically structured here. All 3 subcodes exist in both systems.

2 shared codes have differing titles between IPC and CPC.

Child Classifications

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H01R 13/17 with spring member on the pin since 1980 IPC+CPC Available in IPC and CPC
H01R 13/18 with the spring member surrounding the socket IPC+CPC Available in IPC and CPC
H01R 13/187 with spring member in the socket since 1980 IPC+CPC Available in IPC and CPC

Top Applicants

Top Applicants (IPC)

Class H01,2013–2023, worldwide · Source: EPO PATSTAT

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 43,574
SAMSUNG ELECTRONICS COMPANY KR 42,206
LG CHEM KR 21,383
APPLIED MATERIALS US 20,441
LG ENERGY SOLUTION KR 20,279
SAMSUNG DISPLAY KR 19,725
CHINESE ACADEMY OF SCIENCES 19,400
TOYOTA MOTOR CORPORATION 18,819
SGCC(STATE GRID CORPORATION OF CHINA) 18,082
TOKYO ELECTRON JP 17,634

Top Applicants (CPC)

Class H01,2013–2023, worldwide · Source: EPO PATSTAT

SAMSUNG ELECTRONICS COMPANY KR 37,897
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
APPLIED MATERIALS US 21,640
LG ENERGY SOLUTION KR 20,770
LG CHEM KR 19,835
TOKYO ELECTRON JP 18,519
ROBERT BOSCH DE 14,595
INTEL CORPORATION US 13,580
MURATA MANUFACTURING COMPANY JP 12,151
SAMSUNG SDI COMPANY KR 12,080