DIFF Subgroup
H01R 13/58 Means for relieving strain on wire connection, e.g. cord grip
Introduced: September 1968
Full Title
Full titles differ between systems:
IPC:
Details of coupling devices of the kinds covered by groups or > Means for relieving strain on wire connection, e.g. cord grip
CPC:
Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 > Means for relieving strain on wire connection, e.g. cord grip
CPC subdivides this area 3x more granularly than IPC with 6 additional codes.
6 codes are CPC-only extensions.
IPC defines codes here since 1980.
Child Classifications
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- H01R 13/59 Threaded ferrule or bolt operating in a direction parallel to the cable or wire since 1980 IPC+CPC Available in IPC and CPC
- H01R 13/595 Bolts operating in a direction transverse to the cable or wire since 1980 IPC+CPC Available in IPC and CPC
Top Applicants
Top Applicants (IPC)
Class H01,2013–2023, worldwide · Source: EPO PATSTAT
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 43,574
- SAMSUNG ELECTRONICS COMPANY KR 42,206
- LG CHEM KR 21,383
- APPLIED MATERIALS US 20,441
- LG ENERGY SOLUTION KR 20,279
- SAMSUNG DISPLAY KR 19,725
- CHINESE ACADEMY OF SCIENCES 19,400
- TOYOTA MOTOR CORPORATION 18,819
- SGCC(STATE GRID CORPORATION OF CHINA) 18,082
- TOKYO ELECTRON JP 17,634
Top Applicants (CPC)
Class H01,2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 37,897
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
- APPLIED MATERIALS US 21,640
- LG ENERGY SOLUTION KR 20,770
- LG CHEM KR 19,835
- TOKYO ELECTRON JP 18,519
- ROBERT BOSCH DE 14,595
- INTEL CORPORATION US 13,580
- MURATA MANUFACTURING COMPANY JP 12,151
- SAMSUNG SDI COMPANY KR 12,080