Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement

Introduced: September 1968

Full Title

Full titles differ between systems:

IPC:

Details of coupling devices of the kinds covered by groups or > Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement

CPC:

Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 > Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement

Of 8 combined children, 7 exist in both systems.

1 codes are CPC-only extensions.

3 shared codes have differing titles between IPC and CPC.

IPC defines codes here since 1980.

Child Classifications

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H01R 13/6205 CPC only CPC only
H01R 13/621 Bolt, set screw or screw clamp since 1980 +1 CPC IPC+CPC Available in IPC and CPC
H01R 13/622 Screw-ring or screw-casing (H01R13/623 takes precedence) since 1990 IPC+CPC Available in IPC and CPC
H01R 13/623 Casing or ring with helicoidal groove since 1980 IPC+CPC Available in IPC and CPC
H01R 13/625 Casing or ring with bayonet engagement since 1980 IPC+CPC Available in IPC and CPC
H01R 13/627 Snap or like fastening since 1980 +5 CPC IPC+CPC Available in IPC and CPC
H01R 13/629 Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure since 1980 +4 CPC IPC+CPC Available in IPC and CPC
H01R 13/639 Additional means for holding or locking coupling parts together, after engagement, since 1980 +3 CPC IPC+CPC Available in IPC and CPC

Top Applicants

Top Applicants (IPC)

Class H01,2013–2023, worldwide · Source: EPO PATSTAT

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 43,574
SAMSUNG ELECTRONICS COMPANY KR 42,206
LG CHEM KR 21,383
APPLIED MATERIALS US 20,441
LG ENERGY SOLUTION KR 20,279
SAMSUNG DISPLAY KR 19,725
CHINESE ACADEMY OF SCIENCES 19,400
TOYOTA MOTOR CORPORATION 18,819
SGCC(STATE GRID CORPORATION OF CHINA) 18,082
TOKYO ELECTRON JP 17,634

Top Applicants (CPC)

Class H01,2013–2023, worldwide · Source: EPO PATSTAT

SAMSUNG ELECTRONICS COMPANY KR 37,897
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
APPLIED MATERIALS US 21,640
LG ENERGY SOLUTION KR 20,770
LG CHEM KR 19,835
TOKYO ELECTRON JP 18,519
ROBERT BOSCH DE 14,595
INTEL CORPORATION US 13,580
MURATA MANUFACTURING COMPANY JP 12,151
SAMSUNG SDI COMPANY KR 12,080