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PCE
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DIFF Subgroup
H01R 13/6466

on substrates, e.g. printed circuit boards [PCB]

Introduced: January 2011

Full Title

Full titles differ between systems:

IPC:

Details of coupling devices of the kinds covered by groups or > specially adapted for high-frequency, e.g. structures providing an impedance match or phase match > Means for preventing cross-talk > by adding capacitive elements > on substrates, e.g. printed circuit boards [PCB]

CPC:

Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 > specially adapted for high-frequency, e.g. structures providing an impedance match or phase match (non-coaxed protective earth or shield arrangements H01R13/648; coaxed connectors specially adapted for high frequency H01R24/40) > Means for preventing cross-talk > by adding capacitive elements > on substrates, e.g. printed circuit boards [PCB]

No child classifications to compare. This is a leaf node in both IPC and CPC.