H01R 13/74 Means for mounting coupling parts in openings of a panel
Introduced: January 1980
Title
Titles differ between systems:
IPC: for mounting coupling parts in openings of a panel
CPC: Means for mounting coupling parts in openings of a panel
Full Title
Full titles differ between systems:
Details of coupling devices of the kinds covered by groups or > Means for mounting coupling parts to apparatus or structures, e.g. to a wall > for mounting coupling parts in openings of a panel
Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 > Means for mounting coupling parts to apparatus or structures, e.g. to a wall > Means for mounting coupling parts in openings of a panel
Of 3 combined children, 0 exist in both systems.
3 codes are CPC-only extensions.
Child Classifications
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Top Applicants
Top Applicants (IPC)
Class H01,2013–2023, worldwide · Source: EPO PATSTAT
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 43,574
- SAMSUNG ELECTRONICS COMPANY KR 42,206
- LG CHEM KR 21,383
- APPLIED MATERIALS US 20,441
- LG ENERGY SOLUTION KR 20,279
- SAMSUNG DISPLAY KR 19,725
- CHINESE ACADEMY OF SCIENCES 19,400
- TOYOTA MOTOR CORPORATION 18,819
- SGCC(STATE GRID CORPORATION OF CHINA) 18,082
- TOKYO ELECTRON JP 17,634
Top Applicants (CPC)
Class H01,2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 37,897
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
- APPLIED MATERIALS US 21,640
- LG ENERGY SOLUTION KR 20,770
- LG CHEM KR 19,835
- TOKYO ELECTRON JP 18,519
- ROBERT BOSCH DE 14,595
- INTEL CORPORATION US 13,580
- MURATA MANUFACTURING COMPANY JP 12,151
- SAMSUNG SDI COMPANY KR 12,080