H01R 4/2466 the contact members having a channel-shaped part, the opposite sidewalls of which comprise insulation-cutting means
Introduced: January 2018
Title
Titles differ between systems:
IPC: the contact members having a channel-shaped part, the opposing sidewalls of which comprise insulation-cutting means
CPC: the contact members having a channel-shaped part, the opposite sidewalls of which comprise insulation-cutting means
Full Title
Full titles differ between systems:
Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation > Connections using contact members penetrating or cutting insulation or cable strands > the contact members having insulation-cutting edges, e.g. of tuning fork type > the contact members having additional means acting on the insulation or the wire, e.g. additional insulation-penetrating means, strain relief means or wire cutting knives > the contact members having a channel-shaped part, the opposing sidewalls of which comprise insulation-cutting means
Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation > Connections using contact members penetrating or cutting insulation or cable strands > the contact members having insulation-cutting edges, e.g. of tuning fork type > the contact members having additional means acting on the insulation or the wire, e.g. additional insulation penetrating means, strain relief means or wire cutting knives > the contact members having a channel-shaped part, the opposite sidewalls of which comprise insulation-cutting means
No child classifications to compare. This is a leaf node in both IPC and CPC.
Top Applicants
Top Applicants (IPC)
Class H01,2013–2023, worldwide · Source: EPO PATSTAT
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 43,574
- SAMSUNG ELECTRONICS COMPANY KR 42,206
- LG CHEM KR 21,383
- APPLIED MATERIALS US 20,441
- LG ENERGY SOLUTION KR 20,279
- SAMSUNG DISPLAY KR 19,725
- CHINESE ACADEMY OF SCIENCES 19,400
- TOYOTA MOTOR CORPORATION 18,819
- SGCC(STATE GRID CORPORATION OF CHINA) 18,082
- TOKYO ELECTRON JP 17,634
Top Applicants (CPC)
Class H01,2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 37,897
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
- APPLIED MATERIALS US 21,640
- LG ENERGY SOLUTION KR 20,770
- LG CHEM KR 19,835
- TOKYO ELECTRON JP 18,519
- ROBERT BOSCH DE 14,595
- INTEL CORPORATION US 13,580
- MURATA MANUFACTURING COMPANY JP 12,151
- SAMSUNG SDI COMPANY KR 12,080