utilising a cam, wedge, cone or ball

Introduced: January 1980

Title

Titles differ between systems:

IPC: using a cam, wedge, cone or ball

CPC: utilising a cam, wedge, cone or ball

Full Title

Full titles differ between systems:

IPC:

Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation > Clamped connections; Spring connections > using a cam, wedge, cone or ball

CPC:

Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation > Clamped connections, spring connections (made by means of terminals specially adapted for contact with, or insertion into, printed circuits H01R12/00) > utilising a cam, wedge, cone or ball

CPC subdivides this area 10x more granularly than IPC with 9 additional codes.

9 codes are CPC-only extensions.

IPC defines codes here since 1980.

Child Classifications

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H01R 4/5008 CPC only CPC only
H01R 4/5016 +1 CPC CPC only CPC only
H01R 4/5033 CPC only CPC only
H01R 4/5041 CPC only CPC only
H01R 4/505 CPC only CPC only
H01R 4/5058 CPC only CPC only
H01R 4/5066 CPC only CPC only
H01R 4/5075 CPC only CPC only
H01R 4/5083 +1 CPC CPC only CPC only
H01R 4/52 which is spring loaded since 1980 IPC+CPC Available in IPC and CPC

Top Applicants

Top Applicants (IPC)

Class H01,2013–2023, worldwide · Source: EPO PATSTAT

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 43,574
SAMSUNG ELECTRONICS COMPANY KR 42,206
LG CHEM KR 21,383
APPLIED MATERIALS US 20,441
LG ENERGY SOLUTION KR 20,279
SAMSUNG DISPLAY KR 19,725
CHINESE ACADEMY OF SCIENCES 19,400
TOYOTA MOTOR CORPORATION 18,819
SGCC(STATE GRID CORPORATION OF CHINA) 18,082
TOKYO ELECTRON JP 17,634

Top Applicants (CPC)

Class H01,2013–2023, worldwide · Source: EPO PATSTAT

SAMSUNG ELECTRONICS COMPANY KR 37,897
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
APPLIED MATERIALS US 21,640
LG ENERGY SOLUTION KR 20,770
LG CHEM KR 19,835
TOKYO ELECTRON JP 18,519
ROBERT BOSCH DE 14,595
INTEL CORPORATION US 13,580
MURATA MANUFACTURING COMPANY JP 12,151
SAMSUNG SDI COMPANY KR 12,080