H01R 4/58 characterised by the form or material of the contacting members (H01R4/01 takes precedence)
Introduced: January 1980
Title
Titles differ between systems:
IPC: characterised by the form or material of the contacting members
CPC: characterised by the form or material of the contacting members (H01R4/01 takes precedence)
Full Title
Full titles differ between systems:
Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation > characterised by the form or material of the contacting members
Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation > characterised by the form or material of the contacting members (H01R4/01 takes precedence)
IPC and CPC are identically structured here. All 5 subcodes exist in both systems.
3 shared codes have differing titles between IPC and CPC.
IPC defines codes here since 1980.
Child Classifications
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- H01R 4/60 Connections between or with tubular conductors (H01R4/56 takes precedence) since 1980 IPC+CPC Available in IPC and CPC
- H01R 4/62 Connections between conductors of different materials; Connections between or with aluminium or steel-core aluminium conductors (H01R4/68 takes precedence) since 1980 +1 CPC IPC+CPC Available in IPC and CPC
- H01R 4/64 Connections between or with conductive parts having primarily a non-electric function, e.g. frame, casing, rail since 1980 +2 CPC IPC+CPC Available in IPC and CPC
- H01R 4/66 Connections with the terrestrial mass, e.g. earth plate, earth pin since 1980 IPC+CPC Available in IPC and CPC
- H01R 4/68 Connections to or between superconductive connectors since 1980 IPC+CPC Available in IPC and CPC
Top Applicants
Top Applicants (IPC)
Class H01,2013–2023, worldwide · Source: EPO PATSTAT
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 43,574
- SAMSUNG ELECTRONICS COMPANY KR 42,206
- LG CHEM KR 21,383
- APPLIED MATERIALS US 20,441
- LG ENERGY SOLUTION KR 20,279
- SAMSUNG DISPLAY KR 19,725
- CHINESE ACADEMY OF SCIENCES 19,400
- TOYOTA MOTOR CORPORATION 18,819
- SGCC(STATE GRID CORPORATION OF CHINA) 18,082
- TOKYO ELECTRON JP 17,634
Top Applicants (CPC)
Class H01,2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 37,897
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
- APPLIED MATERIALS US 21,640
- LG ENERGY SOLUTION KR 20,770
- LG CHEM KR 19,835
- TOKYO ELECTRON JP 18,519
- ROBERT BOSCH DE 14,595
- INTEL CORPORATION US 13,580
- MURATA MANUFACTURING COMPANY JP 12,151
- SAMSUNG SDI COMPANY KR 12,080