DIFF Subgroup
H04N 25/70 SSIS architectures; Circuits associated therewith
Introduced: January 2023
Full Title
Circuitry of solid-state image sensors [SSIS]; Control thereof > SSIS architectures; Circuits associated therewith
IPC and CPC are identically structured here. All 7 subcodes exist in both systems.
IPC defines codes here since 2023.
Child Classifications
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- H04N 25/702 SSIS architectures characterised by non-identical, non-equidistant or non-planar pixel layout since 2023 IPC+CPC Available in IPC and CPC
- H04N 25/703 SSIS architectures incorporating pixels for producing signals other than image signals since 2023 IPC+CPC Available in IPC and CPC
- H04N 25/71 Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors since 2023 +1 CPC IPC+CPC Available in IPC and CPC
- H04N 25/76 Addressed sensors, e.g. MOS or CMOS sensors since 2023 +1 CPC IPC+CPC Available in IPC and CPC
- H04N 25/79 Arrangements of circuitry being divided between different or multiple substrates, chips or circuit boards, e.g. stacked image sensors since 2023 IPC+CPC Available in IPC and CPC
Top Applicants
Top Applicants (IPC)
Class H04,2013–2023, worldwide · Source: EPO PATSTAT
- QUALCOMM US 97,396
- HUAWEI TECHNOLOGIES COMPANY CN 96,502
- SAMSUNG ELECTRONICS COMPANY KR 86,981
- TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) SE 55,869
- HUAWEI TECHNOLOGIES COMPANY 55,349
- LG ELECTRONICS KR 53,649
- CANON 33,341
- SONY CORPORATION JP 32,761
- ZTE CORPORATION CN 32,274
- GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORPORATION 28,327
Top Applicants (CPC)
Class H04,2013–2023, worldwide · Source: EPO PATSTAT
- HUAWEI TECHNOLOGIES COMPANY CN 101,476
- QUALCOMM US 101,139
- SAMSUNG ELECTRONICS COMPANY KR 96,655
- TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) SE 57,744
- LG ELECTRONICS KR 55,253
- HUAWEI TECHNOLOGIES COMPANY 54,181
- SONY CORPORATION JP 35,309
- ZTE CORPORATION CN 32,950
- INTEL CORPORATION US 27,533
- GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORPORATION CN 27,498