DIFF Subgroup
H04N 25/79 Arrangements of circuitry being divided between different or multiple substrates, chips or circuit boards, e.g. stacked image sensors
Introduced: January 2023
Full Title
Circuitry of solid-state image sensors [SSIS]; Control thereof > SSIS architectures; Circuits associated therewith > Arrangements of circuitry being divided between different or multiple substrates, chips or circuit boards, e.g. stacked image sensors
No child classifications to compare. This is a leaf node in both IPC and CPC.