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DIFF Subgroup
H05B 3/48

heating conductor embedded in insulating material

Introduced: September 1968

Full Title

Full titles differ between systems:

IPC:

Ohmic-resistance heating > Heating elements having the shape of rods or tubes > non-flexible > heating conductor embedded in insulating material

CPC:

Ohmic-resistance heating > Heating elements having the shape of rods or tubes (H05B3/62, H05B3/68, H05B3/78 take precedence) > non-flexible > heating conductor embedded in insulating material

IPC and CPC are identically structured here. All 2 subcodes exist in both systems.

Child Classifications

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  • H05B 3/50 heating conductor arranged in metal tubes, the radiating surface having heat-conducting fins IPC+CPC Available in IPC and CPC
  • H05B 3/52 Apparatus or processes for filling or compressing insulating material in tubes IPC+CPC Available in IPC and CPC

Top Applicants

Top Applicants (IPC)

Class H05,2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG ELECTRONICS COMPANY KR 7,201
  2. PANASONIC INTELLECTUAL PROPERTY 6,828
  3. SEMICONDUCTOR ENERGY LABORATORY COMPANY 3,988
  4. LG ELECTRONICS KR 3,564
  5. PANASONIC INTELLECTUAL PROPERTY JP 3,533
  6. SAMSUNG DISPLAY KR 3,310
  7. FUJI JP 2,870
  8. SAMSUNG ELECTRO-MECHANICS COMPANY KR 2,675
  9. GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORPORATION 2,665
  10. MURATA MANUFACTURING COMPANY JP 2,634

Top Applicants (CPC)

Class H05,2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG ELECTRONICS COMPANY KR 9,981
  2. SAMSUNG DISPLAY KR 5,041
  3. LG ELECTRONICS KR 4,742
  4. PHILIP MORRIS PRODUCTS CH 4,411
  5. PANASONIC INTELLECTUAL PROPERTY JP 3,915
  6. PANASONIC INTELLECTUAL PROPERTY 3,471
  7. SAMSUNG ELECTRO-MECHANICS COMPANY KR 3,210
  8. MURATA MANUFACTURING COMPANY JP 3,191
  9. FUJI JP 2,987
  10. SIGNIFY HOLDING NL 2,907