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DIFF Subgroup
H05B 3/50

heating conductor arranged in metal tubes, the radiating surface having heat-conducting fins

Introduced: September 1968

Full Title

Full titles differ between systems:

IPC:

Ohmic-resistance heating > Heating elements having the shape of rods or tubes > non-flexible > heating conductor embedded in insulating material > heating conductor arranged in metal tubes, the radiating surface having heat-conducting fins

CPC:

Ohmic-resistance heating > Heating elements having the shape of rods or tubes (H05B3/62, H05B3/68, H05B3/78 take precedence) > non-flexible > heating conductor embedded in insulating material > heating conductor arranged in metal tubes, the radiating surface having heat-conducting fins

No child classifications to compare. This is a leaf node in both IPC and CPC.

Top Applicants

Top Applicants (IPC)

Class H05,2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG ELECTRONICS COMPANY KR 7,201
  2. PANASONIC INTELLECTUAL PROPERTY 6,828
  3. SEMICONDUCTOR ENERGY LABORATORY COMPANY 3,988
  4. LG ELECTRONICS KR 3,564
  5. PANASONIC INTELLECTUAL PROPERTY JP 3,533
  6. SAMSUNG DISPLAY KR 3,310
  7. FUJI JP 2,870
  8. SAMSUNG ELECTRO-MECHANICS COMPANY KR 2,675
  9. GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORPORATION 2,665
  10. MURATA MANUFACTURING COMPANY JP 2,634

Top Applicants (CPC)

Class H05,2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG ELECTRONICS COMPANY KR 9,981
  2. SAMSUNG DISPLAY KR 5,041
  3. LG ELECTRONICS KR 4,742
  4. PHILIP MORRIS PRODUCTS CH 4,411
  5. PANASONIC INTELLECTUAL PROPERTY JP 3,915
  6. PANASONIC INTELLECTUAL PROPERTY 3,471
  7. SAMSUNG ELECTRO-MECHANICS COMPANY KR 3,210
  8. MURATA MANUFACTURING COMPANY JP 3,191
  9. FUJI JP 2,987
  10. SIGNIFY HOLDING NL 2,907