Moulding and encapsulation; Deposition techniques; Protective layers

Full Title

Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00 > Moulding and encapsulation; Deposition techniques; Protective layers

Of 3 combined children, 0 exist in both systems.

3 codes are CPC-only extensions.

Note: 3 CPC extensions are marked as secondary classification only.

This code exists only in CPC.

Diff view requires codes present in both systems.

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