CPC Subgroup Additional Only
H05K 2203/13 Moulding and encapsulation; Deposition techniques; Protective layers
Full Title
Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00 > Moulding and encapsulation; Deposition techniques; Protective layers
3 direct subcodes
Child Classifications
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- H05K 2203/1305 Moulding and encapsulation
- H05K 2203/1333 Deposition techniques, e.g. coating
- H05K 2203/1377 Protective layers