DIFF Subgroup Additional Only
H05K 2203/1461 Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
Full Title
Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00 > Related to the order of processing steps > Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
Of 1 combined children, 0 exist in both systems.
1 codes are CPC-only extensions.
Note: 1 CPC extensions are marked as secondary classification only.
Top Applicants
Top Applicants (IPC)
Class H05,2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 7,201
- PANASONIC INTELLECTUAL PROPERTY 6,828
- SEMICONDUCTOR ENERGY LABORATORY COMPANY 3,988
- LG ELECTRONICS KR 3,564
- PANASONIC INTELLECTUAL PROPERTY JP 3,533
- SAMSUNG DISPLAY KR 3,310
- FUJI JP 2,870
- SAMSUNG ELECTRO-MECHANICS COMPANY KR 2,675
- GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORPORATION 2,665
- MURATA MANUFACTURING COMPANY JP 2,634
Top Applicants (CPC)
Class H05,2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 9,981
- SAMSUNG DISPLAY KR 5,041
- LG ELECTRONICS KR 4,742
- PHILIP MORRIS PRODUCTS CH 4,411
- PANASONIC INTELLECTUAL PROPERTY JP 3,915
- PANASONIC INTELLECTUAL PROPERTY 3,471
- SAMSUNG ELECTRO-MECHANICS COMPANY KR 3,210
- MURATA MANUFACTURING COMPANY JP 3,191
- FUJI JP 2,987
- SIGNIFY HOLDING NL 2,907