CPC Subgroup Additional Only
H05K 2203/1461 Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
Full Title
Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00 > Related to the order of processing steps > Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
1 direct subcode
Child Classifications
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- H05K 2203/1469 Circuit made after mounting or encapsulation of the components