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CPC Subgroup Additional Only
H05K 2203/1461

Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors

Full Title

Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00 > Related to the order of processing steps > Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors

1 direct subcode

Child Classifications

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  • H05K 2203/1469 Circuit made after mounting or encapsulation of the components

Top Applicants

Top 10 applicants by patent filingsfor class H05, 2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG ELECTRONICS COMPANY KR 9,981
  2. SAMSUNG DISPLAY KR 5,041
  3. LG ELECTRONICS KR 4,742
  4. PHILIP MORRIS PRODUCTS CH 4,411
  5. PANASONIC INTELLECTUAL PROPERTY JP 3,915
  6. PANASONIC INTELLECTUAL PROPERTY 3,471
  7. SAMSUNG ELECTRO-MECHANICS COMPANY KR 3,210
  8. MURATA MANUFACTURING COMPANY JP 3,191
  9. FUJI JP 2,987
  10. SIGNIFY HOLDING NL 2,907