DIFF Subgroup
H10N 30/02 Forming enclosures or casings
Introduced: January 2023
Full Title
Full titles differ between systems:
IPC:
Piezoelectric or electrostrictive devices > Manufacture or treatment > Forming enclosures or casings
CPC:
Piezoelectric or electrostrictive devices (integrated devices or assemblies of multiple devices H10N39/00) > Manufacture or treatment > Forming enclosures or casings
No child classifications to compare. This is a leaf node in both IPC and CPC.