DIFF Subgroup
H10N 30/03 Assembling devices that include piezoelectric or electrostrictive parts
Introduced: January 2023
Full Title
Full titles differ between systems:
IPC:
Piezoelectric or electrostrictive devices > Manufacture or treatment > Assembling devices that include piezoelectric or electrostrictive parts
CPC:
Piezoelectric or electrostrictive devices (integrated devices or assemblies of multiple devices H10N39/00) > Manufacture or treatment > Assembling devices that include piezoelectric or electrostrictive parts
No child classifications to compare. This is a leaf node in both IPC and CPC.