Mounting of piezoelectric or electrostrictive parts together with semiconductor elements, or other circuit elements, on a common substrate

Piezoelectric or electrostrictive devices > Manufacture or treatment > Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base > Mounting of piezoelectric or electrostrictive parts together with semiconductor elements, or other circuit elements, on a common substrate

Piezoelectric or electrostrictive devices (integrated devices or assemblies of multiple devices H10N39/00) > Manufacture or treatment > Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base > Mounting of piezoelectric or electrostrictive parts together with semiconductor elements, or other circuit elements, on a common substrate