Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base

Introduced: January 2023

Full Title

Full titles differ between systems:

IPC:

Piezoelectric or electrostrictive devices > Manufacture or treatment > Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base

CPC:

Piezoelectric or electrostrictive devices (integrated devices or assemblies of multiple devices H10N39/00) > Manufacture or treatment > Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base

IPC and CPC are identically structured here. All 3 subcodes exist in both systems.

IPC defines codes here since 2023.

Child Classifications

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H10N 30/071 Mounting of piezoelectric or electrostrictive parts together with semiconductor elements, or other circuit elements, on a common substrate since 2023 IPC+CPC Available in IPC and CPC
H10N 30/072 by laminating or bonding of piezoelectric or electrostrictive bodies since 2023 IPC+CPC Available in IPC and CPC
H10N 30/074 by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing since 2023 IPC+CPC Available in IPC and CPC