H10N 30/072 by laminating or bonding of piezoelectric or electrostrictive bodies
Introduced: January 2023
Full Title
Full titles differ between systems:
Piezoelectric or electrostrictive devices > Manufacture or treatment > Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base > by laminating or bonding of piezoelectric or electrostrictive bodies
Piezoelectric or electrostrictive devices (integrated devices or assemblies of multiple devices H10N39/00) > Manufacture or treatment > Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base > by laminating or bonding of piezoelectric or electrostrictive bodies
IPC and CPC are identically structured here. All 1 subcodes exist in both systems.
IPC defines codes here since 2023.
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