DIFF Subgroup
H10P 52/20 Electromechanical polishing [EMP]; Electrochemical mechanical polishing [ECMP]
Introduced: January 2026
Full Title
Grinding, lapping or polishing of wafers, substrates or parts of devices > Electromechanical polishing [EMP]; Electrochemical mechanical polishing [ECMP]
Of 4 combined children, 0 exist in both systems.
4 codes are CPC-only extensions.
Child Classifications
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