DIFF Main Group
H10P 52/00 Grinding, lapping or polishing of wafers, substrates or parts of devices
Introduced: January 2026
IPC and CPC are identically structured here. All 2 subcodes exist in both systems.
1 shared codes have differing titles between IPC and CPC.
IPC defines codes here since 2026.
Child Classifications
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- H10P 52/20 Electromechanical polishing [EMP]; Electrochemical mechanical polishing [ECMP] since 2026 +4 CPC IPC+CPC Available in IPC and CPC
- H10P 52/40 Chemomechanical polishing [CMP] (electrochemical mechanical polishing H10P52/20) since 2026 +2 CPC IPC+CPC Available in IPC and CPC