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PCE
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DIFF Subgroup
H10P 54/30

by forming weakened zones for subsequent cutting or separating, e.g. by laser treatment or by ion implantation

Introduced: January 2026

Full Title

Cutting or separating of wafers, substrates or parts of devices > by forming weakened zones for subsequent cutting or separating, e.g. by laser treatment or by ion implantation

No child classifications to compare. This is a leaf node in both IPC and CPC.