by forming weakened zones for subsequent cutting or separating, e.g. by laser treatment or by ion implantation

Full Title

Cutting or separating of wafers, substrates or parts of devices > by forming weakened zones for subsequent cutting or separating, e.g. by laser treatment or by ion implantation

Classification Context

Section:

ELECTRICITY

Class:

SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR

Subclass:

GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS