DIFF Main Group
H10P 54/00 Cutting or separating of wafers, substrates or parts of devices
Introduced: January 2026
IPC and CPC are identically structured here. All 5 subcodes exist in both systems.
IPC defines codes here since 2026.
Child Classifications
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- H10P 54/30 by forming weakened zones for subsequent cutting or separating, e.g. by laser treatment or by ion implantation since 2026 IPC+CPC Available in IPC and CPC
- H10P 54/40 by sawing, e.g. using revolving or reciprocating blades since 2026 IPC+CPC Available in IPC and CPC