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DIFF Subgroup
H10P 54/94

After-treatments, e.g. removal of adhesive tapes or supports

Introduced: January 2026

Full Title

Cutting or separating of wafers, substrates or parts of devices > Auxiliary processes or arrangements > After-treatments, e.g. removal of adhesive tapes or supports

No child classifications to compare. This is a leaf node in both IPC and CPC.